HAUPPAUGE, N.Y.—Muller Martini has acquired patents for the VSOP (variable sleeve offset press) technology from Drent Goebel. A new Muller Martini VSOP series, offering flexible packaging and cardboard printing, will be launched by the end of 2009.
SPRINGFIELD, Mass. - Océ North America has joined the Paperboard Packaging Council (PPC) as an associate member.
BURNSVILLE, Minn.—Stand-up Pouches 2009-2012 is a global study of the stand-up pouch industry. It provides an up-to-date assessment of the stand-up pouch market including market drivers, consumption volumes, market trends, and competitive products. It also provides a quantitative forecast through 2012.
LINTHICUM, Md.-The Flexible Packaging Association will hold its 2009 Fall Executive Conference on September 24 at The Ritz-Carlton Hotel in Chicago. The single-day conference combines industry-focused educational programs with networking opportunities.
NORCROSS, Ga.—Demonstrating its continued commitment to environmental responsibility, RockTenn announced that it has received triple chain-of-custody (CoC) certification for its Marion, N.C. folding carton plant.
Chicago, Ill.—GPA, a supplier of substrate solutions for HP Indigo digital presses, announced that it has been granted the designation of HP Preferred Partner for a second year in a row. The HP Media Team designed the Preferred Partner program to establish a standard of excellence for partners who exhibit best in class service and support, provide extensive depth and availability of HP Indigo certified substrates, and excel in supporting HP Indigo’s sales and marketing efforts.
TOTOWA, N.J.—The board of directors of the Pitman Company announced that it has appointed Anthony P. Crupi, Sr. as chief executive officer. Crupi was recently named to the Pitman board of directors.
SPRINGFIELD, Mass.—Leaders in innovation and sustainability will converge to offer insight, analysis, and resources during the 2009 Paperboard Packaging Council (PPC) Fall Meeting & Leadership Conference, Wednesday, Oct. 29 through Friday, Oct. 30, at the Barton Creek Resort, Austin, Texas.
NORTH ROYALTON, Ohio—GEW has donated a seven-lamp ECP UV system with e-brick electronic power supplies to aid research and development activities at Clemson University’s new Sonoco Institute of Packaging Design and Graphics.
HARTSVILLE, S.C.—Sonoco, one of the largest diversified global packaging companies, will speak to the investment community on Wednesday, June 3, 2009, at the Goldman Sachs 2009 Basic Materials Conference in New York City.
