Business Management - Operations

Sun Chemical Names New President and CEO
October 2, 2018 at 8:58 am

Sun Chemical has announced that Myron Petruch will be its new president and CEO. Petruch will officially begin in this capacity on Jan. 1, 2019, succeeding Rudi Lenz, who will transition to the role of Sun Chemical's vice chairman of the board.

Koenig & Bauer Seeks Increased Role in Offset Label Market
July 25, 2018 at 1:34 pm

Koenig & Bauer is strengthening its position and focus to target the globally increasing demand for all types of offset printed labels. As part of this refocus, Koenig & Bauer's research and development team is working to produce critical press features for this growing market.

Leading Printing Industry Analyst Joins NAPCO Media
July 10, 2018 at 9:54 am

Lisa Cross has joined NAPCO Research, a division of NAPCO Media, as principal analyst. Cross, who was formerly the associate director of Keypoint Intelligence-InfoTrends’ Business Development Strategies service, will author original research.

Mondi to Expand in U.S. for Increased Flat-Bottom Bag Production
June 14, 2018 at 9:56 am

Citing increases in demand for flexible packaging, Mondi is expanding its U.S. operations for increased flat-bottom bag production. Mondi is targeting the food, pet food and home and personal care markets for these flexible packaging applications.

Industry Veteran Bob Fish Joins Domino
May 8, 2018 at 4:42 pm

Domino announced Bob Fish would join the team as account manager, Digital Printing North America, covering Michigan, Ohio, Indiana and Kentucky. Fish has more than 20 years of experience in the industry.

A Closer Look at Packaging Industry Business Challenges and Solutions
April 17, 2018 at 9:42 am

In order to maximize the opportunities the packaging industry offers, printers of labels, folding cartons, flexible packaging and corrugated need to be aware of the business challenges they face and have a plan to mitigate their impact. packagePRINTING has released a new research report that details the key challenges package printers face and provides insight into how to solve these issues.