Tyco Electronics teams with Graphic Solutions for state-of-the-art RFID equipment

The continuous web assembly system produces inlays that offer numerous performance improvements over conventional printed circuit boards. The system allows mounting flip chips for almost any purpose, as well as the ability to mount most standard SMDs along with GSI’s printed batteries. The line has the ability to mount on paper, PET, or other flexible substrates, and features a variable width capability up to 20˝ (500 mm) wide. It can accommodate printed substrates from 0.002˝ (50 mm) to 0.005˝ (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8˝ (20 mm), and position chips to micron accuracy. Benefits of this assembly line include high speed, high accuracy, and reliability of mounting.