Cutting Die Technology for Ultra-Thin Liners
The use of thinner and thinner substrates is leaving no margin for error in diecutting processes.
By
Steve Lee
and Brent Fischmann
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Waste/matrix removal is another area of attention when converting ultra-thin liners. The nature of the light die strike on a thin film means there will be areas that are in tolerance, but light enough that you need to help the waste removal. As with a number of challenging materials being converted today, you may have to employ the same stripping/waste removal "fixes" currently used for high speeds. Tests performed at our Converting Technology Center have clearly demonstrated the need to help the stripping process as speeds increase to 1,000 ft./min.
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Steve Lee
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