Cutting Die Technology for Ultra-Thin Liners
The use of thinner and thinner substrates is leaving no margin for error in diecutting processes.
The challenges of handling 23 micron/0.00092˝ PET liners are leading to innovative die station solutions. New technology is being demonstrated today to avoid direct strike to the liner altogether by a process of delaminating and re-laminating the substrate layers, and the use of chilled dies.
Matrix stripping and strike control
Related Content
Comments
