Cutting Die Technology for Ultra-Thin Liners
The use of thinner and thinner substrates is leaving no margin for error in diecutting processes.
By
Steve Lee
and Brent Fischmann
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The transition to 23 micron/0.00092˝ PET liner material—or even thinner (20 micron/0.00075˝)—is also posing new challenges for diecutting. There is literally no room for error cutting to the ultra-thin PET layer. With the ultra-thin liner materials, pressure sensitive diecutting requires separation of the face stock and adhesive while ensuring that the die does not touch the liner or cause a break during automated label dispensing. New flexible die technology has emerged in direct response to the new challenges of film substrates, with suppliers optimizing performance for 20/23/25 micron PET.
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Steve Lee
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