Problem Solved

Terrance Clark, sales manager, TAKK Industries

Problem—One of the most challenging problems we’ve encountered is in label printing and converting. With cut-and-stack labels, the converter typically prints on a film substrate and then diecuts and stacks the completed labels. A technique called “bumping and stacking” is used to gather the labels into a uniform stack and package them. Problems occur when static electricity—generated on the film substrate as it moves through multiple stations—causes the delivered labels to stick together.