RadTech to Host uv.eb EAST 2009
BETHESDA, Md.—RadTech, the Association for UV and EB Technology, is hosting uv.eb EAST 2009, October 20-21 in Niagra Falls, N.Y. Ultraviolet (UV) and Electron Beam (EB) curing technologies will be presented to brand owners, printers, and converters. These technologies can provide: sustainable and flexible manufacturing; energy efficiency and savings; increased ROI; higher quality products; and lower greenhouse gas and VOC emissions.
There will be specific sessions on UV and EB curing for printing & packaging with the following presentations:
• UV/EB Equipment for Printing and Packaging Applications (Steve Lapin, PCT Engineered Systems)
• Enhancing Dot Reproduction Reliability, Print Quality, and Printer Efficiency and Productivity Using UV/EB Technology (Randy Butler, Printpack, Inc.)
• Energy Savings & Production Efficiencies for EB/UV Offset Printing (Rick Sanders, Energy Sciences, Inc.)
• Unique Things UV/EB Chemistry Allows You to Do (Tony Bean, Sun Chemical)
• Food Packaging with UV/EB Curing (Albert Lin, Henkel Corporation)
• Digital Printing: Coating Technologies on the Verge of a Revolution (Dr. Sascha Bernhardt, Hymmen North America Ltd)
• Sustainability and UV/EB Technology (Sean Evans, Amgraph Packaging)
The conference and table top exhibition will include intro and advanced courses, a table top exhibition featuring leading supplier companies, and specific sessions on the use of UV and EB curing in printing/packaging, photovoltaics, wood finishing, and industrial applications including metal and plastics.
Visit www.uvebeast.com to register.
