WS Packaging Group and ASK Form Joint Venture

"Bringing the manufacturing to the US, ultimately improves our value
proposition in specific vertical markets," said Wayne Richter, WS Packaging
chief manufacturing officer. "It gives us access to RFID technology
currently being used, and further allows us to leverage ASK's rich heritage
of research and development for custom RFID applications in the future. This arrangement will greatly enhance our position in the RFID market by raising our level of credibility and product scope."