PH: One other dream for printed electronics is printing many components on top of each other. This will save space and eliminate the wiring needed by conventional silicon chips, displays and so on. Will Thinfilm memory be layered with other components one day?
Johan Carlsson: Certainly, this in fact one of the basic ideas behind Thinfilm’s hybrid memory technology where multiple layers of memory were used in order to increase memory capacity/unit area. All of the drive electronics was situated below the stacked polymer memories. When it comes to printed electronics this is all dependent on the solubility of various layers (electronics polymers) and/or development of processes through separation layers. So by using the right set of materials one can envision that our memory could be printed on top or below other components.