RFID Labels for Package Printing
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Editor’s note: RFID is running hot and cold in the North American packaging market. It’s a technology solution still in its early development, with many issues, risks, and potential rewards. In this column, Peter Harrop, CEO of IDTechEx, provides a glimpse of some of the behind-the-scenes factors that will impact future implementation of RFID. IDTechEx is a knowledge-based consultancy company that provides research and analysis on RFID, printed and organic electronics, and smart packaging. It will host the RFID Smart Labels USA 2008 conference in Boston February 20-21 (www.idtechex.com/USA).
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Dr. Peter Harrop
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