Parelec Inc. Teams with TAGSYS for Direct-on-Packaging RFID Solution

ROCKY HILL, N.J.—Parelec Inc. has announced the development of a breakthrough in direct-on-packaging RFID in partnership with TAGSYS, USA (Cambridge, MA), the global leader in item-level RFID infrastructure.

The commercially viable RFID tag system can be printed on corrugated packaging using Parelec’s Parmod VLT ink. This patented technology is comprised of metal particles in a reactive organic medium (ROM) that volatize during the heating process. Thin, narrow circuit lines are possible using efficient single station printing. The result is a faster, lower cost process with more highly conductive circuits. Parmod technology from Parelec and the Adaptive Kernal UHF technology from TAGSYS print the RFID tag directly to the package allowing customers to optimize the fit and performance of the tag to each unique product package while saving time and cost in production.

“This program is a giant step,” said Elie Simon, president and CEO of TAGSYS. “With our Adaptive Kernal technology and in collaboration with Parelec, we have built a solution that is both reliable and affordable for customers.”

“Too many people still think of RFID as technology that’s on the next horizon,” said Geva Barash, president and CEO of Parelec. “Through our Certified Partner Program, and joint ventures like this one with TAGSYS, innovative solutions are being put in place right now.”

This TAGSYS Adaptive Kernal and Parelec’s direct print RFID solution generated significant interest at the Smart Labels USA conference in Boston. Parelec also announced that a full-scale implementation of this breakthrough solution at a customer site would begin later this year.