Printer News - September 2012

Bemis to Develop Intelligent Labels

NEENAH, Wis.—Bemis Company announced that it has signed a joint development agreement with Thin Film Electronics ASA to develop a Bemis Intelligent Packaging Platform. The agreement will accelerate the commercial development of functional sensor labels manufactured from new and emerging printed electronic technology made from Thin Film's proprietary read/writable printed memory and program logic. When used with Bemis packaging, the line of "intelligent" labels will monitor and record key physical properties and environmental data in packaged perishable products.