NovaCentrix PCS 1100 Curing System To Be Displayed at IDTechEx 2007
AUSTIN, Texas—NovaCentrix, a leader in emerging printed electronics technologies, announced that one of its printed electronics curing systems will for the first time be on display and operating at the IDTechEx conference in San Francisco, Nov. 13-14. Branded as Photonic Curing systems, this patented technology instantly cures and sinters metal based inks at room temperature by exposing the printed patterns to a millisecond-long intense pulse of light from high-energy flash lamps. The system rapidly and selectively heats and fuses metallic ink particles forming highly conductive traces without heating the base substrate material. With Photonic Curing technology, printed conductive patterns and traces can be cured without the dwell-times associated with thermal cure systems, and on substrates which cannot tolerate the elevated temperatures of thermal cure systems.
NovaCentrix has delivered multiple R&D-class PCS 1100 machines to customers developing new inks and applications requiring the high-speed low-temperature substrate capabilities of the Photonic Curing technology. NovaCentrix is also developing a high-speed commercial system for integration with roll-to-roll print systems such as ink-jet, flexographic, gravure and rotary screen printing. The PCS 3300, will be available in Q2 2008, and will be capable of up to 60 meters per minute line cure speeds.
“We are excited about the opportunity to showcase our PCS 1100 Photonic Curing system at the IDTechEx conference in November,” said Steve Leach, CEO of NovaCentrix. “We’re getting excellent customer response, and the IDTechEx conference is the perfect venue for reaching our target customers. The show attendance has been growing for the last several years, and now is the time to participate by joining in the sponsorship of the event with a strong company presence. Our Photonic Curing technology is a great fit with the intent of the event.
Leach continued, “We’re confident the attendees will resonate with this new ability to cure printed electronics at room temperature enabling the use of low-temperature and cost effective substrates on high speed print lines. This capability really opens up the opportunities for improved low-cost applications, and can generate tremendous value by enabling new types of electronics products.”