IADD/FSEA Odyssey is Looking Forward to 2009

ATLANTA, Ga.—Exhibit sales are strong for the 2009 IADD/FSEA Odyssey, to be held May 6-9 in Atlanta, Ga. Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the three-day event at the Cobb Galleria will provide information specific to diecutting, diemaking, foil stamping/embossing, and many other trade finishing processes.

Changes in scheduling will afford attendees and exhibitors alike the opportunity to experience a wide variety of classroom and TechShop™ educational sessions, with even more time to gather valuable information on industry trends in the Exhibition Hall. Changes also are in store for the increasingly popular TechShop™ sessions, a unique set of workshops where technical challenges are tackled on-press in a production-like environment. Advancements in audio-visual and high-speed camera equipment promise to heighten the real-time action in these ‘live’ workshops to a new level.

Enhancements to the overall format of the 2009 Odyssey will provide opportunity for attendees to explore the vast array of new technologies showcased in the exhibition hall. “Already, we are at 75 percent capacity for exhibit space—a record for one year from the event,” reported Odyssey Exhibit Coordinator Sue Corcoran. “We expect to showcase more machinery in production at this show than at any other Odyssey in the past. This is a strong indication of the value—to both exhibitor and attendee—this growing event continues to offer.”

For more information on the 2009 IADD/FSEA Odyssey, visit www.iadd.org/odyssey or contact the IADD directly at 1-800-828-IADD or the FSEA at 1-785-271-5816.