Focus on Fundamentals in the CPP Expo Educational Program

PARAMUS, N.J.-H. A. Bruno, LLC, organizers of CPP EXPO Chicago, have finalized the educational program which will complement the activity on the CPP EXPO show floor, and all activities throughout McCormick Place. Taking place Oct. 29-Nov. 2, 2006, CPP EXPO has partnered with leading technical providers in crafting a program that focuses on the fundamentals in converting operations and also provides innovation on the flexible packaging front.

The program takes place over the course of 4 days; a sampling of the sessions follows:

AIMCAL presents: Coating & Laminating – 3- part presentation: “Top 11 Steps to Prevent Defects”; Moderated by Edward D. Cohen - Edward D. Cohen Consulting.

Adhesive & Sealant Council + Adhesives & Sealants Magazine present: Adhesive & Sealant Technology for Flexible Packaging/Labeling and more: Part I – Formulations; Part II – Applications; Moderated by: Pui Chi Wong, Communications Specialist - Adhesive and Sealant Council; and Ms. Teresa McPherson, Editor - ASI – Adhesives & Sealants Industry Magazine.

AIMCAL presents: Web Handling Parts I & II; focusing on the foundations of web machine design and control with special emphasis on rollers & tensions; Moderated respectively by: David Rosium, Ph. D., and Timothy J Walker – TJ Walker & Associates, Inc.

CEMA presents: Slitting & Rewinding Fundamentals for Converting/Packaging Professionals; Moderated by: Mr. Ron Schmidt, Director - Maxcess International Corporation/Fife Corporation.

CSiA: “How to Choose the Right Integrator for Your Industry”; Moderated by: Michael C. Murphy, Vice President – Circonix Technologies.

CEMA’s Safety Division presents: Product Safety Practices & Risk Management: Contributing to the Machinery Manufacturer’s & User’s Bottom Line; Moderated by: Jeff Behnke – Appleton Manufacturing.

Technical programming is bolstered by pavilions on the exhibit floor that will enhance the attendees’ experience. Industry pavilions featured include: AIMCAL, Adhesives: ASC-ASI, and CSiA.

In addition, the “CONFERENCE at PACK EXPO” features 63 sessions in 4 tracks over the course of 3 days with industry leaders’ keynotes highlighting the programming daily.

“The interaction inherent on the exhibit floor is now mirrored in the educational and technical programming at the upcoming events. The keynoters are a prime example of the synergies at this three-dimensional event -- they are truly of interest to the converting, packaging, and processing professionals in attendance. It is rare, and many times impossible, to have presentations that reach the universe of exhibitors and attendees,” stated Leo Nadolske, president of CPP EXPO. “CPP EXPO will continue to offer such reach and interaction to ensure that it becomes the principal marketplace for the converting/package printing industry sectors.”

Registration for CPP EXPO is now open; you need to only register for one exhibit, one badge will allow you access all three exhibits, pavilions, and specialty centers. You must register for the conference sessions/programming separately and must be registered for the exhibit in order to participate in the educational program. Visit www.cppexpo.com for registration and to receive updated details on programming.