Esko Gifts $1.2 Million to Indiana State Packaging Engineering Program

Esko, a global supplier of integrated hardware and software for the packaging, label and wide format sectors, has made a $1.2 million in-kind gift to Indiana State University’s packaging engineering technology program. Esko support includes annual licensing for its design and production software platforms.

Melissa Plemen, Director of Marketing North America, said: “At Esko we believe in investing in the future of our industry. It’s clear that our sector has an aging workforce and an emerging skills gap, which programs like the one at Indiana State University are key to resolving.

“We are extremely lucky to have the commitment of the ISU to packaging, helping to stimulate knowledge building and innovation in to the future. We are proud to partner with them to support the development of packaging students — our future packaging heroes who will drive efficiency, break down barriers and make a real difference to the businesses that they join. In our small way, we hope we are enabling the next generation of leaders in packaging to emerge.”

“We would like to thank Esko for their generous support of Indiana State University and our packaging engineering technology program,” said Andrea Angel, Vice President for University Advancement and CEO of the ISU Foundation. “The experience for our students to work with the same software that develops nine out of 10 retail packages furthers our commitment to hands-on learning and career readiness.”

With the software donation, Indiana State students will have access to work with a leading global product portfolio that supports and manages the packaging and print processes for brand owners, retailers, designers, packaging manufacturers, and more.

“We use Esko software in six of our core packaging courses to learn a wide range of skillsets to prepare our students for the diverse and fast-paced packaging industry,” said Brian James, Indiana State packaging instructor. “This is a tremendous product that gives our students the ability to design and create packaging systems from ideation to virtual and physical prototypes.”

“The College of Technology is excited that Esko has chosen to partner with our packaging engineering technology program. Having their award-winning software in our classrooms will have a tremendous impact on our program and aligns with our vision to partner with industry leaders,” said Nesli Alp, Dean of the College of Technology.

Source: Esko

The preceding press release was provided by a company unaffiliated with Packaging Impressions. The views expressed within do not directly reflect the thoughts or opinions of the staff of Packaging Impressions.