Clemson Names Packaging Facility for Harpers

The Sonoco Institute for Packaging Design and Graphics is located in the Harris A. Smith Building at Clemson. The institute serves as a hub of technology collaboration that brings faculty and students together.

The concept for collaboration focused on packaging-industry projects was developed by the departments of packaging science and graphic communications. The institute focuses on designing environmentally sustainable packages; developing electronic films that can be printed on packages to create displays, track shipments or apply environmental or biological sensors; testing the impact of package design on consumer attention, buying patterns, use, and disposal in its consumer experience lab; and integrating the multiple steps in package design and construction into a single workflow.