Bobst Gears Up for IADD•FSEA Odyssey

ROSELAND, N.J.—Bobst Group North America will be exhibiting the latest in diecutting, foil stamping, and folding gluing technologies at the IADD•FSEA Odyssey in Milwaukee, Wis. During the May 2-4 event, Bobst will have representatives on hand at booth #317 and in the Techshop where the company will be displaying three of its machines—the SPanthera 106-LER Diecutter, SP 102-BMA Foilmaster, and the Mistral 110 A-2 CS Folder-gluer.